PackPlus 2015 records a good show!

Packaging exhibition PackPlus 2015 was successfully held from July 30-August 2, 2015 at Pragati Maidan, New Delhi. A report. PackPlus is one of the well-known packaging exhibitions in the country and there was record turnout in its 2015 edition. By the time the four-day exhibition drew to a close on August 2, the busy staff at the thronging registration counters did hand out the 13,608th visitor’s badge. The portends were visible early as the pre-registrations on the website had outstripped all previous records by some margins.

This show also set PackPlus firmly on the growth path. After the aborted attempt to create a new home for the event away from Pragati Maidan for three editions, the exhibition had returned to its traditional venue and instantly started to grow. This year’s edition was 30 percent larger than the previous year and the re-bookings point to a bumper event going forward.

“The exhibitors signing up during the ongoing event itself with increased areas for next edition is an indication that we are heading towards a big growth,” said an elated Neetu Arora, director, (P) Limited, the organisers of the event. She was also feeling overwhelmed with the scores of congratulatory messages that poured in from satisfied exhibitors and trade visitors equally.

The exhibitors had lined up an array of product launches and running machines. Several exhibitors reported sales during the exhibition itself while all others were inundated with enquiries.

Gabbar Engineering Co, manufacturer of industrial sewing machines was overwhelmed with the response and said perhaps they should have brought more number of machines for ‘onsite’ sale. One more sole exhibitor offering laser-cut dies Bhawani Graphics got over 500 enquiries from packaging printers during the show days of PackPlus. SK Maurya, manager sales & support –Expert Industries Pvt Ltd conveyed as ‘overall good show.’

The International Packaging Conclave conducted in an adjacent hall at the venue was in the meantime, exploring new terrain as it focused on the phenomenal growth of organised retail and e-commerce and its impact on packaging. It looked at the issues that affect packaging through the entire value chain in interactive sessions and deliberated on new materials, tools and systems that can help connect the dots in the entire process. The conclave featured over 15 thought leaders and experts in the field and 125 delegates from all over the country. There were three sessions - Design & Structure of Packaging for Modern Retail & E-Commerce, Flexible Filling Systems & Automation, and Adaptive Supply Chains and Last Mile Connectivity.

“This has been a tremendous experience for me to interact with a knowledgeable panel and a responsive audience,” said Venky Karuppanan of Teezle, who had flown in from New York to be part of the panel on ‘Adaptive Supply Chains and Last Mile Connectivity’. The next edition of the PackPlus will be held from July 27 – 30, 2016

Group Publications